Job Description
High-Speed Digital Design Engineer / Digital Design Lead / Signal Integrity Engineer
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Naperville, IL
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Up to $150,000
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A High-Speed Digital Design Engineer / Digital Design Lead / Signal Integrity Engineer is required for a hands-on technical leadership role focused on high-speed optical module and co-packaged optics development.
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This High-Speed Digital Design Engineer position will suit an electrical engineering professional with experience developing high-speed optical modules, transceivers or transponders, and the ability to technically lead electrical data path development from concept through to production.
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High-Speed Digital Design Engineer / Digital Design Lead / Signal Integrity Engineer Benefits:
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- Up to $150,000
- Bonus
- Health Insurance
- 401k pension plan
- Annual PTO
- Opportunities for growth and development
- Monthly team bonding experiences including free lunches, activities, and events.
- Inclusive culture that listens to and welcomes diverse perspectives.
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The High-Speed Digital Design Engineer / Digital Design Lead / Signal Integrity Engineer Role:
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- Lead the development of 200G+ systems and interfaces for next-generation optical product offerings.
- Drive technology selection, architecture, development, integration and productization of high-speed digital systems.
- Work on 224G / 448G PAM4 signal and power integrity for advanced interconnect applications.
- Define PCB material selection, stack-ups and high-speed PCB design considerations.
- Analyze S-parameters, eye diagrams, crosstalk, jitter and COM performance metrics.
- Assess host, switch fabric, xPU and optical technologies required for high-speed interconnects.
- Collaborate with cross-functional engineering teams and external partners to deliver system-wide solutions.
- Provide technical guidance and ment orship to junior design team members.
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High-Speed Digital Design Engineer / Digital Design Lead / Signal Integrity Engineer Requirements:
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- BS degree in Electrical Engineering.
- 3+ years of hands-on experience developing high-speed optical modules.
- Experience with high-speed transceiver or transponder development, ideally for 200G / PAM4+ interconnects.
- Experience in the design and application of 224G or 448G PAM4 or PAM6 interconnects.
- Knowledge of OIF-CEI or IEEE standards.
- PCB-level hardware design and debugging experience.
- Strong understanding of high-speed signaling fundamentals, channel behavior, PCB technologies and design constraints.
- Experience with SI simulation tools such as ADS, HFSS or equivalent.
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