Senior/Principal Hardware Engineer - High-Speed RF / Signal Integrity (On-site)
Job Description
About Polaris Electro-Optics
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Polaris Electro-Optics is a rapidly growing photonics company developing breakthrough
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optical interconnect technology for data centers, AI, and high-performance computing.
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Their proprietary FenGlass™ platform integrates ferroelectric nematic materials into silicon
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photonics, enabling faster, compact, and more energy-efficient solutions. Located in San
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Diego and backed by substantial funding, Polaris is scaling to meet demand from hyperscale
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customers and transceiver suppliers.
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Role Summary
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We are looking for a Senior or Principal Hardware Engineer to own the high-speed electrical implementation and signal-integrity validation of next-generation optical interconnect hardware.
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This role is highly hands-on and focused on the RF and signal-integrity implementation of next-generation optical interconnect hardware. The engineer will work closely with internal photonics, systems, packaging, and test teams to translate system-level requirements into robust high-speed electrical interfaces and hardware, then carry those designs through simulation, fabrication, bring-up, characterization, and qualification.
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The role will also serve as a key technical interface to OSATs, substrate and PCB vendors, connector suppliers, and high-speed component partners.
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Responsibilities
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- Design high-speed PCBs and contribute to substrate/SLP electrical interface definition for >100 GBaud-class signaling.
- Work with OSATs and substrate vendors on SLP stack-up, routing constraints, bump interfaces, manufacturability, and high-speed electrical performance.
- Own the architecture and implementation of high-speed electrical interfaces and RF hardware for optical interconnect systems.
- Perform pre-layout and post-layout SI analysis using S-parameters, channel simulation, and electromagnetic simulation as appropriate.
- Define high-speed interfaces between test equipment, MZM drivers, TIAs, photonic modules, and host electronics.
- Work closely with photonics, package, systems, and test engineers to optimize electrical/optical co-design.
- Lead high-speed board bring-up, debug, characterization, and failure analysis.
- Define and execute qualification plans for high-speed PCB and substrate interfaces, including insertion loss, return loss, crosstalk, impedance, skew, and signal-quality validation.
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Qualifications
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- B.S., M.S., or Ph.D. in Electrical Engineering or related field.
- Significant industry experience in high-speed hardware and signal-integrity design.
- Strong background in signal integrity for multi-tens-of-GHz electrical interfaces.
- Experience designing and bringing up high-speed PCBs using low-loss or hybrid RF stack-ups.
- Deep understanding of differential signaling, transmission lines, impedance control, reflections, loss, crosstalk, and power integrity.
- Experience with S-parameters, VNA measurements, oscilloscopes, high-speed pattern generators/BERTs, and related RF test equipment.
- Experience with one or more SI/EM tools such as Ansys HFSS/SIwave, Cadence Sigrity, or equivalent.
- Comfortable working hands-on in the lab and debugging first-of-kind hardware.
- Able to make technical decisions with incomplete information and rapidly converge toward a working system.
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Preferred
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- Experience with optical transceivers, silicon photonics, linear-drive optics, or SerDes interfaces.
- Experience with 50 GBaud or >100 GBaud PAM4 electrical links.
- Experience integrating linear MZM drivers and TIAs.
- Familiarity with IEEE 802.3, OIF CEI, or related datacom standards.
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